What is a precision machining?
Precision machining, high-precision machining, ultra-precision machining mainly ultra-precision turning, grinding and polishing the mirror. In the ultra-precision lathe with finely ground single crystal diamond turning tool trace turning, cutting thickness of only about 1 micron, commonly used in the processing of non-ferrous materials spherical, aspherical mirrors and other high-precision flat, smooth surface height Components. E.g., the processing fusion device having a diameter of 800 mm the aspherical mirror, the most accurate up to 0.1 m, the surface roughness of Rz0.05 microns.
Precision high-precision machining, ultra precision machining nano, and even eventually to atomic units (atomic lattice distance of 0.1 to 0.2 nm) is the goal, machining methods can not meet, it needs special precision machining method, the application chemical, electrochemical, thermal or electrical energy, so that these energies beyond the binding energy between atoms, thereby removing the attachment portion between the workpiece surface atoms, combined or lattice deformation, in order to achieve ultra-precision machining. Belong to this type of processing chemical mechanical polishing, ion sputtering and ion implantation, electron beam exposure shot, laser beam machining, metal deposition and molecular beam epitaxy. Characteristics of these methods is the amount of the surface layer of the material can be removed or added as a very fine control. However, to obtain ultra-precision machining accuracy still depends on precision processing equipment and precise control system, and the use of ultra-precision mask as intermediary.
For example VLSI plate is to use electron beam on the photoresist mask (see photolithography) in exposure shot, make the photoresist electrons strike atoms in the direct polymerization (or decomposition), and then with a developer over the polymerization or polymerization had partially dissolved away, made masks. Electron beam exposure shot plate need to use table positioning accuracy up to ± 0.01 micron ultra-precision machining equipment.
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