Ultra-precision machining parts Machining and special presentation
Ultra-precision machining parts
Ultra-precision machining parts machining mainly ultra-precision turning, grinding and mirror polishing. In the ultra-precision lathe with finely ground single crystal diamond turning tool trace turning, cutting thickness of only about 1 micron, commonly used in the processing of non-ferrous materials spherical, aspherical mirrors and other high-precision flat, smooth surface height parts. Processing means such as fusion with a diameter of 800 mm the aspherical mirror, the most accurate up to 0.1 m, surface roughness of Rz0.05 microns.
Special ultra-precision machining parts
Ultra-precision machining accuracy of nanometer, or even eventually atomic units (atomic lattice distance of 0.1 to 0.2 nm) when targeting ultra-precision parts machining methods can not meet the need by method of special precision machining parts, namely Applied Chemistry energy, electrochemical energy, heat or electricity, so that these energies beyond the binding energy between atoms, thereby removing the attachment portion between the surface atoms, or a combination of lattice deformation, in order to achieve ultra-precision machining. There are examples of such processing chemical mechanical polishing, ion sputtering and ion implantation, electron beam exposure shot, laser beam machining, metal deposition and molecular beam epitaxy.
Features These ultra-precision parts machining method is to remove the surface layer of the substance or the amount added can be made very fine control. But to obtain ultra-precision machining accuracy still depends on precision processing equipment and precise control systems, and the use of ultra-precision mask as intermediary. Such as VLSI plate is to use electron beam photoresist mask on (see photolithography) were exposed shot, make the photoresist in the atomic electrons strike under the direct polymerization (or decomposition), then with the developer over the polymerization or polymerization had partially dissolved away to form a mask. Electron beam exposure need to adopt emission plate table positioning accuracy up to ± 0.01 microns ultra-precision machining equipment.
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